Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)

ABSTRACT

A corrosive composition, such as an alkaline aqueous carbon dispersion, a cleaner, a cleaner conditioner, or a conditioner, comprises a corrosion inhibitor, e.g., benzotriazole. The corrosion inhibitor is present in an amount effective to reduce or stop the dissolution of metal from a metallic surface, such as a printed circuit board, in contact with the composition. A method to reduce or stop the dissolution of metal from a metallic surface in contact with a corrosive composition, and a method to stabilize or recover a corrosive composition containing metal contaminants by adding an effective amount of a corrosion inhibitor to the corrosive composition.

RELATED APPLICATIONS

[Not Applicable]

BACKGROUND OF THE INVENTION

The present invention generally relates to a composition comprising acorrosion inhibitor and a method for using the corrosion inhibitor toreduce or stop corrosion of metal from a metallic surface in a corrosiveenvironment. One aspect of the present invention relates moreparticularly to such a composition and method to reduce or stopcorrosion of copper from a circuit board in a solution containingetching agents, such as in a colloidal carbon dispersion, a cleaner, ora conditioner.

In the manufacture of printed circuit boards (PCBs), especiallymultilayer PCBs, treatment chemicals that can etch copper from thecopper surfaces of the circuit boards are employed in several steps. Forexample, aqueous carbon dispersions or electroless metal depositionbaths are used to provide a conductive coating on through holes, viawalls and other initially nonconductive surfaces of PCBs. (“Throughholes” are holes drilled through double-sided or multilayer circuitboards to complete circuits between the circuit patterns. A “via” asused herein refers either to a through hole or to an open or blindrecess, however formed. Vias and through holes can be formed bydrilling, by laser or plasma ablation, additively (as by using aphotoresist), or in any other way presently known or discovered in thefuture.) Also, both before and after the PCBs are coated with theaqueous carbon dispersions or electroless metal deposition baths, thePCBs are often treated with cleaners, or conditioners. These aqueouscarbon dispersions, cleaners and conditioners commonly contain copperetching agents such as ammonia and monoethanolamine (MEA) that willdissolve copper from the circuit boards into the solution.

Information about such aqueous carbon dispersions, cleaners,conditioners, electroplating baths, and methods for using them, can befound in U.S. Pat. Nos. 5,476,580, 5,389,270, 5,690,805, and 5,725,807issued to Thorn et al. and U.S. Pat. Nos. 6,375,731 and 6,440,331 issuedto Carano, et al. The patents referred to in the preceding sentence areincorporated herein by reference in their entireties. Graphitecompositions, cleaners, conditioners, and other materials and directionsneeded to practice these patents are available under the trademarkShadow® from Electrochemicals Inc., Maple Plain, Minn. Other carbondispersions containing carbon black, cleaners and conditioners aredescribed, for example, in U.S. Pat. No. 5,139,642, and are availableunder the trademark Blackhole® from Olin Hunt Specialty Products, Inc.of West Paterson, N.J. This specification may refer to a Shadow®graphite bath or a Blackhole® carbon black bath, while referring toother solutions containing etching agents generally as cleaners,conditioners, electroplating bathes, etc.

A problem with the current manufacture of PCBs is that a Shadow®graphite bath (or a Blackhole® carbon black bath) dissolves copper fromthe circuit boards contacted by the bath. Because a Shadow® graphitebath is alkaline, it can also react with carbon dioxide (CO₂) from theair to form copper carbonate. The copper, copper carbonate or carbonatedissolved in a Shadow® graphite bath causes the bath to form gels. Gelformation leads to a diminished bath life. Cleaners and conditioners cancause similar problems because they also have alkaline etching agents(e.g. MEA) in them and are corrosive solutions. Most cleaners andconditioners used in the PCB industry are dumped on the basis of howmuch copper is in them.

In other words, in the prior art, copper metal on the circuit boards isattacked by ammonia in the Shadow® graphite solution, or by MEA or otheracids or bases in the cleaners or conditioners. The bath becomesineffective, and then must be disposed of, when it is fouled with excesscopper, and new baths are made. This will not only increasemanufacturing cost but also raise an environmental issue. Solutionscontaminated with copper must be treated before being disposed, and thiswill certainly incur waste treatment cost.

In the prior art, after the metallic surface of a circuit board iscorroded in a cleaner, a conditioner or a Shadow® graphite bath, onewould apply a corrosion inhibitor such as benzotriazole (BTA) ortolytriazole (TTA) to the board, and then leave the circuit board inair, tap water, or some other non-corrosive environment, so the metallicsurface of the board will not tarnish. One way of doing this is toemploy BTA, TTA or mixtures of both in a relatively non-corrosivesolution such as water or only mildly acidic water, and apply thissolution to the copper surface after it has been treated in a cleaner, aconditioner or a graphite bath and after corrosion has happened. Thepurpose of this solution is to impart corrosive inhibition to the coppersurface after drying. This use of a corrosion inhibitor in prior art isto stop tarnish from forming on the surface of “dry” copper exposed toair while boards are waiting for the next process step. But such use ofcorrosion inhibitors does not prevent corrosion from happening inside acorrosive environment in the first place. And this use does not prolongthe life of a cleaner, a conditioner or a graphite bath.

BRIEF SUMMARY OF THE INVENTION

An object of the present invention is to reduce the degree or rate ofcorrosion of copper surfaces by a colloidal carbon bath.

Another object of the present invention is to prevent MEA or other basesor acids from etching copper from PCBs immersed in cleaners andconditioners.

An additional object of the present invention is to reverse gelformation caused or accelerated by the uptake of copper into an aqueouscarbon dispersion.

Other objects of the invention will become apparent to one skilled inthe art who has the benefit of this specification and the prior art.

It is surprisingly found in the present invention that adding acorrosion inhibitor directly to an alkaline dispersion, such as anaqueous carbon dispersion, a cleaner, or a conditioner, can reduce orstop the attack of a metal surface immersed in the dispersion andincrease the bath life. Put in other words, by adding an effectiveamount of corrosion inhibitor in a corrosive composition, corrosioninhibition is occurring in situ in an otherwise extremely corrosiveenvironment for metal dissolution. It is further found that suchadditives can unexpectedly reverse the gelled state of a dispersion evenafter corrosion and/or gel formation have occurred.

In a first aspect, the present invention provides a compositionincluding from about 0.1 to about 25% by weight of electricallyconductive carbon and a corrosion inhibitor in an amount effective toreduce the dissolution of metal from a metallic surface in contact withthe composition. The metallic surface can be, for example, a PCB withcopper traces or cladding. The electronically conductive carbon may becarbon black, graphite, or a combination of them. Depending on theamount present in the composition, the corrosion inhibitor can eitherreduce or totally stop the corrosion of metal from a the metallicsurface immersed in the composition.

The amount of a corrosion inhibitor in the composition can be from about1 ppm to about 10,000 ppm (1% by weight), alternatively from about 50ppm to about 4000 ppm, alternatively from 200 ppm to 600 ppm. Thecorrosion inhibitor can be a compound or a mixture of compounds selectedfrom an imidazole, a triazole, an indole, an azole, a thiazole, or atetrazole. An example of such a corrosion inhibitor is BTA. Otherexamples of inhibitors are tolyltriazole (TTA), 3-amino-1,2,3-triazole,sodium mercaptobenzothiazole (Na MBT) and thiourea.

In a second aspect, the present invention provides a compositionincluding a conditioning agent, a cleaning ingredient, or a combinationof both, and a corrosion inhibitor in an amount effective to reduce orstop the dissolution of metal from a metallic surface in contact withthe composition. The cationic conditioning agent or cleaning ingredientcan be an active component of a cleaner and/or conditioner. Thecomposition may further include a binding agent and/or an anionicdispersing agent, which are commonly seen in cleaners and conditioners.Depending on the user's need, the type of cleaner or conditioner and thespecific kind of corrosion inhibitor used, the amount of inhibitor inthe composition may vary. In one embodiment, the concentration of theinhibitor is from about 1 ppm to about 10,000 ppm (1% by weight),alternatively from about 50 ppm to about 4000 ppm, alternatively from200 ppm to 600 ppm. The inhibitor can be any of the inhibitors definedabove.

In another aspect, the invention provides a method to reduce thedissolution of metal from a metallic surface in a corrosive composition,including adding an effective amount of a corrosion inhibitor to thecomposition, and then applying the composition to the metallic surface.The metallic surface, for example, can be part of a PCB with coppertraces or cladding, and the corrosive composition can be, for example, acolloidal carbon dispersion, a cleaner, a conditioner or anelectroplating bath. The amount and type of the corrosion inhibitor tobe added can be as described above.

Still another aspect of the invention provides a method to stabilize orrecover a corrosive composition, including the steps of:

-   -   (1) presenting a metallic surface to the corrosive composition        under conditions effective to dissolve metal from the metallic        surface;    -   (2) dissolving metal from the metallic surface in the corrosive        composition; and    -   (3) adding a corrosion inhibitor to the corrosive composition in        an amount effective to stabilize or recover the corrosive        composition.

The corrosion inhibitor can be added to the corrosive compositioncontaining metal contaminants to prevent gel formation. The corrosioninhibitor can also be added after gel formation has occurred in anamount effective to at least partially reverse the gel formation.

In an embodiment of this aspect of the invention, the corrosivecomposition is a carbon dispersion, such as a graphite and/or carbonblack dispersion, and the metallic surface is a copper surface of a PCB.After a period of use, the carbon dispersion with no corrosion inhibitorbecomes gelled as contaminant (such as copper) content increases.Depending on his/her needs, a user can apply about 1 ppm to about 10,000ppm (1% by weight) of a corrosion inhibitor, such as BTA, to the carbondispersion to at least partially reverse the gelled state of the carbondispersion.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

[Not Applicable]

DETAILED DESCRIPTION OF THE INVENTION

While the invention will be described in connection with one or morepreferred embodiments, it will be understood that the invention is notlimited to those embodiments. On the contrary, the invention includesall alternatives, modifications, and equivalents as may be includedwithin the spirit and scope of the appended claims.

In one aspect, the present invention is directed to a corrosioninhibitor that can be added directly as an extra ingredient to PCBfabrication chemicals such as aqueous carbon dispersions, cleaningcompositions and conditioning compositions and can work effectivelyinside an otherwise extremely corrosive environment for metaldissolution. These compositions, without the corrosion inhibitor inthem, are known, commercially available, and are described in numerouspublications, including U.S. Pat. Nos. 5,139,642, 5,389,270, 5,476,580,5,690,805, 5,725,807, 6,375,731 and 6,440,331 that are all incorporatedherein by reference.

PCBs (also known as printed wiring boards or PWBs) are generallylaminated assemblies of two or more plates or foils of conductivematerial (commonly copper or copper plated with solder or a preciousmetal such as gold), which are separated from each other by a layer ofnon-conducting material including epoxy glass, polyimide, PTFE andcyanate ester. Although copper is generally used as the conductive metalin PCBs, those skilled in the art will recognize that other metals suchas nickel, gold, palladium, silver and the like can also be used asconductive layers on PCBs.

To make electrical connections between the circuit patterns of adouble-sided or multi-layer board, through holes are first drilled atdesired locations of a PCB through the laminate of copper plates and thenonconducting layer(s). After drilling through holes, the holes usuallyare deburred and cleaned, and the PCB is subject to a precleaningprocess to place it in condition for receiving the liquid carbondispersion. During this precleaning process, a cleaner and conditionercomposition is usually used.

Cleaners and conditioners normally are alkaline aqueous solutionscomprising a base. The base can be a lower alkanol amine (lower alkanolbeing defined as 1- to 4-carbon alcohol moieties), such as anethanolamine, for example mono-, di- or triethanolamine; an alkalimaterial generally, such as an alkali metal hydroxide, carbonate, orbicarbonate, for example potassium hydroxide, carbonate, or bicarbonate;any other material capable of raising the pH of the composition,preferably to at least about 9; and mixtures of such materials.

The base, without the presence of a corrosion inhibitor as taught by thepresent invention, can etch copper from PCBs. Virtually every cleaner,cleaner conditioner, or conditioner used in the PCB industry dissolvescopper metal from the PCBs. Copper concentration increases as the bathsare used. One can walk into virtually any PCB shop and see cleaner bathsthat are blue or green because the cleaner solution is very corrosivetowards copper and copper metal has dissolved in it during the usefuloperation of the cleaner. Once a certain copper concentration is reachedin the baths, they are discarded and new baths have to be made becausecopper contamination decreases their effectiveness.

A cleaner may further comprise a cleaning ingredient, such as a cationicor nonionic surfactant. A conditioner may further comprise aconditioning agent, which is a substantive material, commonly a cationicmaterial such as a polyamidoamine, a cationic polymer, a cationicsurfactant, or the like (e.g., SANDOLEC CF catonic polyelectrolyte).Beyond the usual conditioning ingredients, the conditioner may includeone or more of the following: a binding agent, a pH buffer, a dispersingagent, and combinations thereof.

Conductive carbon aqueous dispersions are next applied to or contactedwith the conditioned PCBs to provide a conductive coating on throughholes, via walls or other nonconductive surfaces of the PCBs. An activecomponent of a conductive composition is conductive carbon, for example,carbon black, graphite, or a combination of the two. The electricallyconductive carbon particles should be present in an amount effective toprovide an electrically conductive coating when the composition isapplied to a substrate. The carbon may be present at from about 0.1 toabout 25% by weight, alternatively from about 0.1 to about 20% byweight, alternatively from about 0.5 to about 10% by weight,alternatively from about 1 to about 7% by weight, alternatively fromabout 3 to about 6.5% by weight of the composition. The methods ofcontacting the dispersion to the PCB include immersion, spraying, andother methods of contacting chemicals used in the PCB industry.

An aqueous carbon dispersion, e.g., a Shadow® graphite bath or aBlackhole® carbon black bath, is usually alkaline with a pH range offrom about 9 to about 11. Such a dispersion, without the presence of acorrosion inhibitor as taught by this invention, dissolves copper fromPCBs when it is applied to the PCBs. A Shadow® graphite bath is acolloid, and any increase in the ionic strength or solution conductivitycan destroy the colloid and cause gel formation. The dissolved copperfrom the PCBs and the dissolved carbon dioxide (CO₂) from the air willincrease the ionic strength and conductivity of the dispersion.

Gel formation starts to occur when the amount of dissolved copperreaches a certain level in the dispersion (e.g., 500 ppm). The gels thatform are mostly made up of the colloidal graphite particles themselveswith copper amongst it. Even though graphite or carbon black dispersionscan gel up from a multitude of contaminants, copper is one of theprimary contaminants as that is what is being submersed into thedispersions. A Shadow® graphite bath is no longer useful when it reachesa certain viscosity and a certain ionic contamination level.

After a PCB is treated with an aqueous carbon dispersion and ready forelectroplating, the PCB is immersed in a suitable electroplating bathfor applying a copper coating on the hole walls of the nonconductinglayer(s). A typical copper electroplating bath uses copper sulfate asthe source of cupric ions. Other electroplating bath compositionscontaining other copper salts or other metal salts such as salts ofnickel, gold, palladium, silver, and the like may also be employed.

The PCB is removed from the copper electroplating bath and then washedand dried to provide a board which is further processed. For example,the PCB may be subjected to a tin-lead electroplating operation. Thepresent invention contemplates the use of any and all treatmentchemicals conventionally employed in the manufacture of PCBs. Therefore,this claimed invention should not be limited to any particular cleaner,conditioner, carbon dispersion, electroplating bath or other treatmentchemical parameters.

The corrosion inhibitor of the present invention may be any corrosioninhibitor that can reduce or stop the corrosion of metals includingcopper. One such corrosion inhibitor is a compound or a mixture ofcompounds containing 5 or 6 membered aromatic N heterocycles andespecially 5 or 6 membered fused aromatic N heterocycles. For example itcan be an imidazole, a triazole, an indole, an azole, a thiazole, atetrazole, or a mixture of them. Examples of suitable corrosioninhibitors are benzotriazole (BTA), tolyltriazole(5-methylbenzotriazole, TTA), sodium mercaptobenzothiazole (Na MBT),3-amino-1,2,3-triazole, thiourea, 1,2,3-benzotriazin-4(3H)-one,benzotriazole-5-carboxylic acid, benzotriazole-1-methanol, and other BTAderivatives.

One contemplated compound is BTA, which is a widely known corrosioninhibitor. BTA is not very soluble in distilled water, so preferably acomposition using the present invention includes solvents, ammonia,ammonium hydroxide, or other compounds that can help to dissolve the BTAin water.

In accordance with an embodiment of the present invention, the abovementioned cleaner or conditioner can also include a corrosion inhibitor.Depending on the concentration of the cleaner or conditioner (i.e.,diluted or concentrated), the need of the user, and the type ofcorrosion inhibitor used, the amount of the corrosion inhibitor presentin the cleaner or conditioner composition may vary in a wide range.Therefore, some routine experimentation may be needed to optimize theconcentration of the inhibitor in a cleaner or conditioner (or inanother composition using the present invention). A typicalconcentration is within the range of from about 1 ppm to about 1% basedon the total weight of the cleaner or conditioner solution,alternatively from about 50 ppm to about 4000 ppm, alternatively fromabout 200 ppm to about 600 ppm. With about 500 ppm of BTA in a typicalcleaner or conditioner bath, almost no copper is dissolved from a PCBimmersed in it.

In another embodiment of the present invention, the above mentionedaqueous carbon dispersion further comprises a corrosion inhibitor. Whenthe dispersion is a colloid, a nonionic corrosion inhibitor is preferredbecause an ionic inhibitor would undesirably increase the conductivityor ionic strength of the bath. Ionic contamination is known to beeffective at flocculating (destroying) hydrophobic colloids like aqueouscarbon based dispersions and other dispersions and cause gel formation.Nonionic corrosion inhibitors such as those having 5 or 6 memberedaromatic N heterocycles and especially 5 or 6 membered fused aromatic Nheterocycles do not cause ionic contamination themselves. A good exampleof a nonionic corrosion inhibitor is BTA or TTA.

Similar to a cleaner or conditioner composition, the amount of thecorrosion inhibitor in the aqueous carbon dispersion may vary in a widerange. A typical amount is from 1 ppm to 10,000 ppm (1% by weight),alternatively from about 50 ppm to about 4000 ppm, alternatively fromabout 200 ppm to about 600 ppm. It was found that in a Shadow® graphitebath using BTA, at a 200 ppm level, a significant reduction in thecopper dissolution rate was perceived. At a 300-400 ppm level, almost nocopper was dissolved into the Shadow® graphite bath from the PCBsimmersed in it.

Although rinsing, drying, other cleaning and conditioning, adhesionpromotion, fixing, additional conductive carbon treatment andmicroteaching steps are not mentioned above, it is within the scope ofthe present invention to add a corrosion inhibitor to a composition usedin any of such steps and other useful steps in the PCB industry, as longas the composition is contacted with the circuit board while the circuitboard is in an otherwise corrosive bath.

The present invention further provides a method to reduce thedissolution of metal from a metallic surface in a corrosive composition,such as a cleaner, a cleaner conditioner, a conditioner, or a carbondispersion. For example, a user or maker of a cleaner, a conditioner, oran aqueous carbon dispersion can add an effective amount of a corrosioninhibitor to the composition, which can then be applied to a circuitboard. Some routine experimentation may be needed for the user or makerto optimize the amount of the inhibitor to be added to the composition.But by adding a corrosion inhibitor to the corrosive composition, metalcorrosion can be reduced or stopped even inside an otherwise extremelycorrosive environment. In accordance with an embodiment of theinvention, a typically amount of corrosion inhibitor needed is fromabout 1 ppm to about 1% by weight, alternatively from aboutalternatively from about 50 ppm to about 4000 ppm, alternatively fromabout 200 ppm to about 600 ppm.

Some corrosion inhibitors, like BTA, TTA or others with 5 or 6 memberedaromatic N heterocycles and especially 5 or 6 membered fused aromatic Nheterocycles, can act as stabilizers to a corrosive compositioncontaining copper or other metal contaminants. One contemplatedmechanism of stabilization is that certain corrosion inhibitors cancomplex the copper or other metal contaminants in the composition.Therefore, the present invention can also be used to stabilize orrecover a corrosive composition that has gelled up after dissolvingmetal from a metallic surface contacting it.

In one embodiment of the present invention, the corrosive composition isan aqueous carbon dispersion which slowly etches copper from the circuitboards treated by it. After the bath is run for a period of time, itcontains too much copper, and gels are formed in the bath due tocontamination from ions. In the prior art, a manufacturer of PCBs wouldfind it necessary to dump the bath. In accordance with the presentinvention, however, the manufacturer can add a corrosion inhibitor tothe corrosive composition in a sufficient amount to reverse the gelformation.

The amount of the corrosion inhibitor used should be effective to atleast partially reverse the gel formed in the bath. When BTA is used, atypical amount is from about 1 ppm to about 1% by weight, alternativelyfrom about 50 ppm to about 4000 ppm, alternatively from about 100 ppm toabout 600 ppm. At 50 ppm level, BTA is capable of reversing gelformation occurred in a Shadow& graphite bath, and at around 100 to 200ppm level, BTA will revitalize the bath.

This invention can be used to treat any corrosive composition any timebefore or after etching has occurred. When the corrosion inhibitor isadded before the corrosive composition contacts a metallic surface, itserves as a corrosion inhibitor. When the corrosion inhibitor is addedafter corrosion has happened, the corrosion inhibitor serves dualpurpose as a stabilizer (and a gel formation reversal agent ordispersion recovery agent) and a corrosion inhibitor. But a user doesnot need to wait until gel has formed, and its use is not limited tocorrosive compositions that will gel up when dissolved metal is present.However, the gel formation reversing method of the present invention isespecially useful when gel formation has already occurred. With theteaching of the present invention, a user can add an effective amount ofa corrosion inhibitor (e.g., BTA or TTA) to the gelled carbon bath. Thegels will go away, and the bath's life is prolonged.

The invention will be better understood by reference to the followingexamples. These examples are provided to describe specific embodimentsof the invention and to demonstrate how it works. By providing thosespecific examples, the inventors do not limit the scope of theinvention. The full scope of the invention is all the subject matterdefined by the claims concluding this specification, and equivalentsthereof.

EXAMPLE 1

Preliminary Comparison Tests of Identical Corrosive Solutions with andWithout BTA

Five 1″×3″ (2.5 cm by 7.6 cm) copper laminate pieces were immersed into250 ml of each of the following solutions with stirring:

-   -   (1) 40 mN NH₃ solution (conductivity=0.26 mS/cm);    -   (2) 40 mN NH₃ and NaCl solution (conductivity=1.6 mS/cm);    -   (3) 40 mN NH3 and NaCl solution (conductivity=1.6 mS/cm)+1g/L/L        BTA (benzotriazole);    -   (4) Shadow® 2, 4% graphite bath (control);    -   (5) Shadow® 2, 4% graphite bath+1 g/L BTA

Results are compared in the following table which clearly shows theeffect of BTA as a corrosion inhibitor. Solutions Results 1 Insolubleblue crystals formed on the copper surface of the board. Copper wasattacked but the complex formed was insoluble. 2 Copper was dissolvedfrom the board and the solution turned blue. But the next morning thesolution became less blue and a reddish brown precipitate (apparentlycopper) clung to the sides of the beaker. 3 Copper was not attacked, andthe solution stayed totally clear even overnight. 4 Titrated after 4hours, 292 ppm Cu was in the solution. 5 Titrated after 4 hours, only 65ppm Cu was in the solution.

The results show that BTA can be directly added to an otherwisecorrosive composition containing ammonia and is capable of stopping orgreatly reducing the copper attack by such a composition.

EXAMPLE 2

Determining the Effective Amount of BTA

Different amounts of BTA were added to fresh Shadow® graphite baths.Five 1″×3″ (2.5 cm by 7.6 cm) copper laminate pieces were immersed intoeach of the baths for 3 hours, then they were removed and all theShadow® solution on the laminate pieces was rubbed off. The pieces wereetched in fresh persulfate (low BTA to high BTA order), then they werereturned to their respective beakers and left overnight. The nextmorning the Cu was titrated. The results are shown in the followingtable: BTA Concentration (ppm) Cu overnight (ppm) 0 552 0 508 1 444 2317 5 393 20 361 100 273 200 190

The results show that BTA has a favorable effect at and above the 1 ppmlevel and starts to be very effective at a 200 ppm level to reduce thecopper attack by the ammonia in the Shadow® graphite solutions.

EXAMPLE 3

Study of Other Potential Corrosion Inhibitors

500 ppm of the following chemicals were added to different fresh Shadow®graphite baths, and three 1.5″×3″ (3.8 cm by 7.6 cm) copper laminatepieces were immersed into each bath with stirring. After 24 hours, theCu was titrated, and the results are shown in the following table. CuShadow ® Amount Graphite Baths Chemicals Added (ppm) Control A Nochemical added 279 Control B No chemical added 222 C Formaldehyde 280 DSodium MBT (Na MBT) 88 E Thiourea (626 ppm was added) 82 F3-amino-1,2,4-triazole 200 G Quadrol 254 H Tolytriazole 209

The results show that both Na MBT and Thiourea are very effective in theproportions used, and are capable of stopping or greatly reducing thecopper attack by the ammonia in the Shadow® solutions. Tolyltriazole and3-amino-1,2,4-triazole also showed some activity in the proportionsused.

EXAMPLE 4

Cleaner And Conditioner III

1 g/L of BTA was added to 20% Cleaner/Conditioner III (“CCIII®”,available from Electrochemicals Inc., Maple Plain, Minn.) and 1 g/L ofcopper metal powder was added. Even after stirring for several days, nocopper powder was dissolved into the solution. A blank solution withoutBTA turned deep blue within one day and all of the copper was dissolved.The result shows that BTA is capable of stopping or greatly reducing thecopper attack by MEA in the CCIII®. Furthermore, the BTA did not itselfcause any harm to the usefulness of the solution.

EXAMPLE 5

Comparison of BTA and Butoxyne 497

The objective of this study is to compare BTA to Butoxyne® 497, acorrosion inhibitor comprising hydroxyethyl ethers of butynediol(available from International Specialty Products, Wayne, N.J.) foreffectiveness at stopping copper corrosion in Shadow® graphite baths andtheir general improvement or degradation of the colloid as compared tocontrols. Four 1.5″ (3.8 cm) by 3″ (7.6 cm) copper pieces were submergedinto each of the four 250 ml of 4% Shadow® solutions for five days. Thecopper in each solution was titrated and the results are shown in thefollowing table. Shadow ® Results/Cu Baths Amount (ppm) Notes andObservations Control 1 762 Here there was a lot of sludge on the copperpieces but the sludge was not rubbed off into the solution. With 500 ppm190 Here there was no sludge on the copper pieces at all BTA and therewas nothing to rub off. Control 2 968 Here there was a lot of sludge onthe copper pieces and the sludge was rubbed off into the solution. With500 ppm 857 Here there was a lot of sludge on the copper pieces Butoxyne497 and the sludge was rubbed off into the solution.

The quality of dispersion of these different Shadow® baths were alsodetermined. A Shadow® solution is a colloidal suspension of graphite inwater. Fresh Shadow® colloids are finely dispersed, however over timeShadow® colloids may gel up and become more viscous. Described below arethe procedures followed to determine the “degree of gelling” in a usedor old Shadow® solution:

-   -   (1) Using a disposable pipette draw up 1 ml of Shadow® solution        into the tube. Invert the tube and suck the solution all of the        way into the bulb portion of the disposable pipette.    -   (2) Place a glass slide on a backlight microscope or camera        system that can view at about 100 to 200×.    -   (3) Shake the pipette to stir the solution just before        dispensing, and then carefully place less than one drop (20-30        μL) of Shadow® solution onto the center of the glass slide by        touching the tip of the disposable pipette to the glass slide        and dispensing about ½ of a centimeter in diameter of solution        onto the glass slide.    -   (4) Very carefully place another glass slide on top of the glass        slide. Be certain not to chafe or rub the two glass slides        together, and do not touch or try to align the two glass slides        after placing the top slide on, as even a small amount of        rubbing or chafing together of the glass slides will break up a        “bad” colloid and make it appear better than it really is.    -   (5) View the Shadow® solution at 100× using a backlight        procedure. The Shadow® dispersion quality cannot be seen by a        front light procedure at all. Place a bright light (fiber optic        goose-neck light) underneath the sample and view as in a        backlight for electroless copper.    -   (6) If the colloidal suspension looks less than perfect right        away, wait a few minutes and observe to see if more gels start        to form over time. A perfectly good dispersion will not show any        gelling even after several minutes. A bad dispersion will show        lots of gels (and much brighter light coming through between        these gels) than a good dispersion. A medium quality dispersion        will not show gels at the start but will begin to gel up after        one or three minutes of being subjected to the strong backlight        fiber optic light.

Dispersion quality (Q) is denoted by an arbitrary scale of 0 to 10 basedon the pictures of colloids at various states, where 10 represents aperfect dispersion with no gels and 0 represents a Shadow® solution thathas totally gelled up.

It was found in this study that the BTA containing sample was of higherdispersion quality (Q=10) than the others. In the other three, colloidalparticle motion stopped very quickly, which is a sign of colloiddegradation.

The study shows that BTA helped stop copper corrosion in Shadow®graphite baths which in turn kept the dispersion quality from degrading(copper causes gelling which has been linked to a degradation inbacklights). The Butoxyne® 497 did not work for this purpose.

EXAMPLE 6

Comparison of a BTA Bath Line with a Non-BTA Bath (Control) Line

Two 1 liter Shadow® lines were run in this study. Each line comprised aShadow® graphite bath and a CCIII® bath. The first line had 500 ppm BTAin both the CCIII® bath and the Shadow® graphite bath. The second linewas a control.

The BTA solution added to the CCIII® bath contained 25 g/L BTA (0.2083M) and 13 g/L MEA (0.21 M). 2% by volume of this solution was added tothe CCIII® bath, which increased the MEA concentration in the CCIII®bath by 0.26 g/L. The BTA solution used for the Shadow® graphite bathwas 25 g/L BTA (0.2083 M) with 0.21 M (NH₄)OH. 2% by volume of thissolution was added to the Shadow® graphite bath, which increased theammonia in the Shadow® bath by 0.004 M.

The results showed that BTA was very effective at a 500 ppm level forkeeping copper out of both the CCIII® and the Shadow® graphite baths.The BTA bath line out-performed the non-BTA bath line in both dispersionquality and backlights.

EXAMPLE 7

Using BTA to Reverse a Gelled Shadow® Graphite Bath and Improve Coverageon Micro-Vias and Blow Hole Coupons

A gelled Shadow® graphite dispersion sample containing 550 ppm Cu wastaken from the pilot line (the dispersion was exposed to coppercontaining circuit boards for 48 hours before BTA was added). 400 ppmBTA was added to the pilot sample and 300 ppm and 500 ppm of BTA wereadded to other gelled shadow samples. There were total 6 samples asfollows:

-   -   1. 0 ppm BTA was added.    -   2. 300 ppm BTA was added.    -   3. 500 ppm BTA was added.    -   4. 300 ppm BTA was added.    -   5. 500 ppm BTA was added.    -   6. Pilot: 400 ppm BTA was added.

The samples were used to apply a graphite coating to coupons. Fullanalyses were performed for all the samples, and the tests were done in500 mL beakers in the lab. The method used to determine the dispersionquality (Q) of the samples was the same as that described in Example 5.The samples were first analyzed shortly after BTA was added, and theresults are shown in the following table: Particle size ConductivityViscosity Backlight (P50 & P95) Q (Glass Samples (mS/cm) pH (CPS) (30X)(μm) Dispersion)  0 ppm BTA 1.56 9.14 14.5 8.7 0.833-4.151 4 300 ppm BTA1.77 9.31 4.3 9.5 0.684-3.828 10 500 ppm BTA 1.87 9.35 3.6 9.70.573-3.479 10 300 ppm BTA 1.74 9.31 4.7 9.5 0.724-3.625 10 500 ppm BTA1.85 9.35 3.8 9.5 0.630-3.674 10 Pilot 1.81 9.22 4.2 9.2 0.494-3.172 10

The bath samples then were allowed to stand for six days and retested tosee if BTA was still effective. The following table shows the new testresults: Particle size Conductivity Viscosity Backlight (P50 & P95) Q(Glass Samples (mS/cm) pH (CPS) (30X) (μm) Dispersion)  0 ppm BTA 1.589.0 10.8 9.0 1.778-5.016 4 300 ppm BTA 1.73 9.12 3.6 9.0 0.913-4.131 10500 ppm BTA 1.83 9.15 3.3 8.8 0.741-3.882 10 300 ppm BTA 1.72 9.13 5.29.0 0.911-4.046 10 500 ppm BTA 1.82 9.14 2.8 9.0 0.741-3.981 10 Pilot1.80 9.03 3.7 9.0 0.881-5.637 8.5

Salt tests were also done for all samples, which measure viscosity ofthe samples after salt was added. The lower the number, the better thesolution is. And the results of the tests are shown as follows: Samples0 g NaCl 0.6 g NaCl 1.2 g NaCl 1.8 g NaCl 2.4 g NaCl  0 ppm BTA 10.832.4 33.7 35.6 39.5 300 ppm BTA 3.6 20.4 24.1 25.8 26.4 500 ppm BTA 3.317.3 22 23.6 24.6 300 ppm BTA 5.2 22.4 25 26.9 27.1 500 ppm BTA 2.8 19.121.7 23.8 24.6 Pilot 3.7 20.8 24.3 23.8 24.1

The results showed that, when present at 300 ppm or more, BTA completelyreversed the gel formation in the samples and also improved theirdispersion qualities and the backlights when the samples were used toconductively coat a through hole. The backlights definitely were bettershortly after BTA was added. Even after allowing the BTA-modifieddispersion to stand for 6 days, the backlight was nearly the same forall samples as when BTA was just added. Particle size and salt test alsobenefited from BTA addition.

BTA not only helps prevent the copper from being etched by a carbondispersion but also improves the dispersion even in the presence ofcopper, and after the bath has gelled up.

1. A composition comprising: A. from about 0.1 to about 25% by weight ofconductive carbon; and B. a corrosion inhibitor, wherein said corrosioninhibitor is present in an amount effective to reduce the dissolution ofmetal from a metallic surface in contact with said composition.
 2. Thecomposition of claim 1 wherein said conductive carbon is selected fromthe group consisting of carbon black, graphite, and combinationsthereof.
 3. The composition of claim 1 wherein said corrosion inhibitoris present in an amount effective to prevent the dissolution of metalfrom said metallic surface in contact with said composition.
 4. Thecomposition of claim 1 wherein said amount of said corrosion inhibitoris from about 1 ppm to about 1% by weight.
 5. The composition of claim 1wherein said amount of said corrosion inhibitor is from about 50 ppm toabout 4000 ppm.
 6. The composition of claim 1 wherein said amount ofsaid corrosion inhibitor is from about 200 ppm to about 600 ppm
 7. Thecomposition of claim 1 wherein said corrosion inhibitor is at least oneof an imidazole, a triazole, an indole, an azole, a thiazole, or atetrazole.
 8. The composition of claim 1 wherein said corrosioninhibitor is benzotriazole or tolyltriazole.
 9. The composition of claim1 wherein said metal is copper.
 10. A composition comprising: A. a base;and B. a corrosion inhibitor, wherein said corrosion inhibitor ispresent in an amount effective to reduce the dissolution of metal from ametallic surface in contact with said composition.
 11. The compositionof claim 10, wherein said base is selected from the group consisting ofmonoethanolamine, hydroxide, carbonate, and combinations thereof. 12.The composition of claim 10, further comprising a conditioning agent, acleaning ingredient, or both.
 13. The composition of claim 10, furthercomprising an ingredient selected from a binding agent, an anionicdispersing agent, or both.
 14. The composition of claim 10 wherein saidcorrosion inhibitor is present in an amount effective to prevent thedissolution of metal from said metallic surface in contact with saidcomposition.
 15. The composition of claim 10 wherein said amount of saidinhibitor is from about 1 ppm to about 1% by weight.
 16. The compositionof claim 10 wherein said amount of said corrosion inhibitor is fromabout 50 ppm to about 4000 ppm.
 17. The composition of claim 10 whereinsaid amount of said corrosion inhibitor is from about 200 ppm to about600 ppm
 18. The composition of claim 10 wherein said corrosion inhibitoris at least one of an imidazole, a triazole, an indole, an azole, athiazole, or a tetrazole.
 19. The composition of claim 10 wherein saidcorrosion inhibitor is selected from the group consisting ofbenzotriazole, sodium mercaptobenzothiazole, thiourea, tolyltriazole,3-amino-1,2,4-triazole, and combinations thereof.
 20. The composition ofclaim 10 wherein said metal is copper.
 21. A method to reduce thedissolution of metal from a metallic surface in a corrosive composition,comprising: providing a corrosive composition; adding an effectiveamount of a corrosion inhibitor to said corrosive composition to reduceits corrosiveness; and applying said composition to said metallicsurface.
 22. The method of claim 21 wherein said amount of saidcorrosion inhibitor is from about 1 ppm to about 1% by weight.
 23. Themethod of claim 21 wherein said amount of said corrosion inhibitor isfrom about 50 ppm to about 4000 ppm by weight.
 24. The method of claim21 wherein said amount of said corrosion inhibitor is from about 200 ppmto about 600 ppm by weight.
 25. The method of claim 21 wherein saidcorrosion inhibitor is at least one of an imidazole, a triazole, anindole, an azole, a thiazole, or a tetrazole.
 26. The method of claim 21wherein said corrosion inhibitor is selected from the group consistingof benzotriazole, sodium mercaptobenzothiazole, thiourea, tolyltriazole,3-amino-1,2,4-triazole, and combinations thereof.
 27. The method ofclaim 21 wherein said metal is copper.
 28. A method to stabilize orrecover a corrosive composition, comprising: presenting a corrosivecomposition; presenting a metallic surface to said corrosive compositionunder conditions effective to dissolve metal from said metallic surface;dissolving metal from said metallic surface in said corrosivecomposition; adding a corrosion inhibitor to said corrosive compositionin an amount effective to stabilize or recover said corrosivecomposition.
 29. The method of 28 wherein said corrosion inhibitor isadded to prevent gel formation in said corrosive inhibitor.
 30. Themethod of claim 28 wherein said corrosion inhibitor is added after gelformation has occurred in said corrosive composition.
 31. The method ofclaim 30 wherein said corrosion inhibitor is added in an amounteffective to at least partially reverse said gel formation.
 32. Themethod of claim 28 wherein said amount of said corrosion inhibitor isfrom about 1 ppm to about 1% by weight.
 33. The method of claim 28wherein said amount of said corrosion inhibitor is from about 50 ppm toabout 4000 ppm.
 34. The method of claim 28 wherein said amount of saidcorrosion inhibitor is from about 200 ppm to about 600 ppm
 35. Themethod of claim 28 wherein said corrosion inhibitor is at least one ofan imidazole, a triazole, an indole, an azole, a thiazole, or atetrazole.
 36. The method of claim 28 wherein said corrosion inhibitoris selected from the group consisting of benzotriazole, sodiummercaptobenzothiazole, thiourea, tolyltriazole, 3-amino-1,2,4-triazole,and combinations thereof.
 37. The method of claim 28 wherein said metalis copper.